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1

High temperature reliability testing of aluminum and tantalum electrolytic capacitors

A. Dehbi, W. Wondrak, Y. Ousten, Y. Danto

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 225 KB

english, 2002

2

Vibration lifetime modelling of PCB assemblies using steinberg model

A. Dehbi, Y. Ousten, Y. Danto, W. Wondrak

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 2.47 MB

english, 2005

3

Defect detection in multilayer ceramic capacitors

V. Krieger, W. Wondrak, A. Dehbi, W. Bartel, Y. Ousten, B. Levrier

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 19.85 MB

english, 2006

4

Power module lifetime estimation from chip temperature direct measurement in an automotive traction inverter

G. Coquery, S. Carubelli, J.P. Ousten, R. Lallemand, F. Lecoq, D. Lhotellier, V. de Viry, Ph. Dupuy

Journal:

Microelectronics Reliability

Year:

2001

File:

PDF, 436 KB

2001

5

The use of impedance spectroscopy, SEM and SAM imaging for early detection of failure in SMT assemblies

Y. Ousten, S. Mejdi, A. Fenech, J.Y. Deletage, L. Bechou, M.G. Perichaud, Y. Danto

Journal:

Microelectronics Reliability

Year:

1998

Language:

english

File:

PDF, 348 KB

english, 1998

6

Localization of defects in die-attach assembly by continuous wavelet transform using scanning acoustic microscopy

L. Bechou, L. Angrisiani, Y. Ousten, D. Dallet, H. Levi, P. Daponte, Y. Danto

Journal:

Microelectronics Reliability

Year:

1999

Language:

english

File:

PDF, 564 KB

english, 1999

7

Constant ΔTj Power Cycling Strategy in DC-mode for top-metal and bond-wire contacts degradation investigations

Tran, Son-Ha, Khatir, Zoubir, Lallemand, Richard, Ibrahim, Ali, Ousten, Jean-Pierre, Ewanchuk, Jeffrey, Mollov, Stefan

Journal:

IEEE Transactions on Power Electronics

Year:

2018

Language:

english

File:

PDF, 1.29 MB

english, 2018

8

Quantitative Rutherford backscattering spectrometry in-depth composition analysis of sputtered TaSi2 layers

J. Schulte, R. Ferretti, W. Hasse, Y. Danto, Y. Ousten

Journal:

Thin Solid Films

Year:

1986

Language:

english

File:

PDF, 295 KB

english, 1986

9

Failure mechanisms and qualification testing of passive components

H.A. Post, P. Letullier, T. Briolat, R. Humke, R. Schuhmann, K. Saarinen, W. Werner, Y. Ousten, G. Lekens, A. Dehbi, W. Wondrak

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 262 KB

english, 2005

10

Effects of silicone coating degradation on GaN MQW LEDs performances using physical and chemical analyses

R. Baillot, Y. Deshayes, L. Bechou, T. Buffeteau, I. Pianet, C. Armand, F. Voillot, S. Sorieul, Y. Ousten

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 1.24 MB

english, 2010

11

Selective activation of failure mechanisms in packaged double-heterostructure light emitting diodes using controlled neutron energy irradiation

Deshayes, Y., Bord, I., Barreau, G., Aiche, M., Moretto, P.H., Béchou, L., Roehrig, A.C., Ousten, Y.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1024 KB

english, 2008

12

Behavioral study of passive components and coating materials under isostatic pressure and temperature stress conditions

B. Trégon, Y. Ousten, Y. Danto, L. Bechou, B. Parmentier

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 578 KB

english, 2002

13

Evaluation of a micropackaging analysis technique by highfrequency microwaves

G. Duchamp, Y. Ousten, Y. Danto

Journal:

Microelectronics Reliability

Year:

2002

File:

PDF, 1.09 MB

2002

14

Acoustic analysis of an assembly: Structural identification by signal processing (wavelets)

J. Augereau, Y. Ousten, L. Béchou, Y. Danto

Journal:

Microelectronics Reliability

Year:

2002

File:

PDF, 1.39 MB

2002

15

Application of Picosecond Ultrasonics to Non-Destructive Analysis in VLSI circuits

G. Andriamonje, V. Pouget, Y. Ousten, D. Lewis, Y. Danto, J.M. Rampnoux, Y. Ezzahri, S. Dilhaire, S. Grauby, W. Claeys, C. Rossignol, B. Audoin

Journal:

Microelectronics Reliability

Year:

2003

File:

PDF, 1.40 MB

2003

16

Use of signal processing imaging for the study of a 3D package in harsh environment

Jean Augereau, Yves Ousten, Bruno Levrier, Laurent Bechou

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 829 KB

english, 2006

17

Degradation behavior of 600 V–200 A IGBT modules under power cycling and high temperature environment conditions

M. Bouarroudj, Z. Khatir, J.P. Ousten, F. Badel, L. Dupont, S. Lefebvre

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 838 KB

english, 2007

18

Reliability investigations of 850nm silicon photodiodes under proton irradiation for space applications

Bourqui, M.L., Béchou, L., Gilard, O., Deshayes, Y., Vecchio, P. Del, How, L.S., Rosala, F., Ousten, Y., Touboul, A.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 258 KB

english, 2008

19

Ultrasonic images interpretation improvement for microassembling technologies characterisation

L. Bechou, Y. Ousten, B. Tregon, F. Marc, Y. Danto, R. Even, P. Kertesz

Journal:

Microelectronics Reliability

Year:

1997

Language:

english

File:

PDF, 313 KB

english, 1997

20

Investigations of thermal interfaces aging under thermal cycling conditions for power electronics applications

J.P. Ousten, Z. Khatir

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 1.39 MB

english, 2011

21

An original DoE-based tool for silicon photodetectors EoL estimation in space environments

P. Spezzigu, L. Bechou, G. Quadri, O. Gilard, Y. Ousten, M. Vanzi

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 912 KB

english, 2011

22

Operational Performances Demonstration of Polymer-Ceramic Embedded Capacitors for MMIC Applications

Bord-Majek, I., Kertesz, P., Mazeau, J., Caban-Chastas, D., Levrier, B., Bechou, L., Ousten, Y.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2011

Language:

english

File:

PDF, 704 KB

english, 2011

23

Power MOSFET active power cycling for medical system reliability assessment

Sow, Amadou, Somaya, Sinivassane, Ousten, Yves, Vinassa, Jean-Michel, Patoureaux, Fanny

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.27 MB

english, 2013

24

Temperature-Level Effect on Solder Lifetime During Thermal Cycling of Power Modules

M. Bouarroudj, Z. Khatir, J. Ousten, S. Lefebvre

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2008

Language:

english

File:

PDF, 1.02 MB

english, 2008

25

[IEEE 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. - Shangri-La's Rasa Sentosa Resort, Singapore (27 June-1July, 2005)] Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. - Study of degradations in PCB interconnections for high frequency applications

Duchamp, G., Verdier, F.J.-M., Levrier, B., Marc, F., Ousten, Y., Danto, Y.

Year:

2005

Language:

english

File:

PDF, 690 KB

english, 2005

26

Crack Propagation Modeling in Silicon: A Comprehensive Thermomechanical Finite-Element Model Approach for Power Devices

Calvez, Damien, Roqueta, Fabrice, Jacques, Sebastien, Bechou, Laurent, Ousten, Yves, Ducret, Samuel

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2014

Language:

english

File:

PDF, 1.62 MB

english, 2014

27

[IEEE 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 - Singapore (9-13 July 2001)] Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548) - New methods for scanning ultrasonic microscopy applications for failure analysis of microassembling technologies

Bechou, L., Ousten, Y., Danto, Y.

Year:

2001

Language:

english

File:

PDF, 886 KB

english, 2001

28

Simulations of Thermomechanical Stresses and Optical Misalignment in 1550-nm Transmitter Optoelectronic Modules Using FEM and Process Dispersions

Deshayes, Yannick, Bechou, Laurent, Verdier, F., Ousten, Yves, Laffitte, D., Goudard, J. L.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2008

Language:

english

File:

PDF, 1.17 MB

english, 2008

29

[IEEE 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (21-25 July 1997)] Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits - The use of impedance spectroscopy, SEM and SAM imaging for early detection of failure in SMT assemblies

Ousten, Y., Mejdi, S., Fenech, A., Deletage, J.Y., Bechou, L., Perichaud, M.G., Danto, Y.

Year:

1997

Language:

english

File:

PDF, 805 KB

english, 1997

30

Failure Mechanisms in Packaged Light-Emitting Diodes Under Gamma Radiations: Piezoelectric Model Based on Stark Effect

Deshayes, Yannick, Baillot, Raphaël, Rehioui, Othman, Béchou, Laurent, Ousten, Yves, Gilard, Olivier

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2011

Language:

english

File:

PDF, 969 KB

english, 2011

31

Light-Emitting Diodes

Deshayes, Y., Bechou, L., Ousten, Y.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2010

Language:

english

File:

PDF, 793 KB

english, 2010

32

[IEEE 2007 European Conference on Power Electronics and Applications - Aalborg, Denmark (2007.09.2-2007.09.5)] 2007 European Conference on Power Electronics and Applications - Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules

Bouarroudj, M., Khatir, Z., Ousten, J.P., Dupont, L., Lefebvre, S., Badel, F.

Year:

2007

Language:

english

File:

PDF, 995 KB

english, 2007

33

Scanning laser ultrasonics experiments for in situ nondestructive analysis of integrated circuits

Andriamonje, G., Pouget, V., Ousten, Y., Lewis, D., Plano, B., Danto, Y.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2005

Language:

english

File:

PDF, 312 KB

english, 2005

34

[IEEE 2015 IEEE Aerospace Conference - Big Sky, MT, USA (2015.3.7-2015.3.14)] 2015 IEEE Aerospace Conference - Monte-carlo computations for predicted degradation of photonic devices in space environment

Bechou, Laurent, Deshayes, Yannick, Ousten, Yves, Gilard, Olivier, Quadri, Gianandrea, Lip Sun How,

Year:

2015

Language:

english

File:

PDF, 2.71 MB

english, 2015

35

Photothermal activated failure mechanism in polymer-based packaging of low power InGaN/GaN MQW LED under active storage

Baillot, Raphael, Deshayes, Yannick, Ousten, Yves, Bechou, Laurent

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 722 KB

english, 2015

36

Overview on Sustainability, Robustness, and Reliability of GaN Single-Chip LED Devices

Deshayes, Yannick, Baillot, Raphael, Joly, Simon, Ousten, Yves, Bechou, Laurent

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2015

Language:

english

File:

PDF, 830 KB

english, 2015

37

Liquid Crystal Polymer for QFN packaging: Predicted thermo-mechanical fatigue and Design for Reliability

Chenniki, Walide, Bord-Majek, Isabelle, Louarn, Mélanie, Gaud, Vincent, Diot, Jean-Luc, Wongtimnoi, Komkrisd, Ousten, Yves

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 725 KB

english, 2015

38

Highlighting two integration technologies based on vias: Through silicon vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability

Balmont, M., Bord Majek, I., Poupard, B., Bechou, L., Ousten, Y.

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.18 MB

english, 2018

39

Analysis of the degradation mechanisms occurring in the topside interconnections of IGBT power devices during power cycling

Dornic, N., Ibrahim, A., Khatir, Z., Tran, S.H., Ousten, J.-P., Ewanchuk, J., Mollov, S.

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 2.49 MB

english, 2018

40

Effect of power cycling tests on traps under the gate of Al2O3/AlGaN/GaN normally-ON devices

Elharizi, M., Zaki, F., Ibrahim, A., Khatir, Z., Ousten, J.P.

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 2.59 MB

english, 2018

41

Comparison between piezoelectric method and ultrasonic signal analysis for crack detection in type II multilayer ceramic capacitors

Y. Ousten, S. Mejdi, L. Bechou, B. Tregon, Y. Danto

Journal:

Quality and Reliability Engineering International

Year:

1998

Language:

english

File:

PDF, 130 KB

english, 1998

42

Measurement of the thermal characteristics of packaged double-heterostructure light emitting diodes for space applications using spontaneous optical spectrum properties

L. Bechou, O. Rehioui, Y. Deshayes, O. Gilard, G. Quadri, Y. Ousten

Journal:

Optics & Laser Technology

Year:

2008

Language:

english

File:

PDF, 804 KB

english, 2008

43

Detection and location of defects in electronic devices by means of scanning ultrasonic microscopy and the wavelet transform

L. Angrisani, L. Bechou, D. Dallet, P. Daponte, Y. Ousten

Journal:

Year:

2002

Language:

english

File:

PDF, 2.52 MB

english, 2002

44

An improved method for automatic detection and location of defects in electronic components using scanning ultrasonic microscopy

Bechou, L., Dallet, D., Danto, Y., Daponte, P., Ousten, Y., Rapuano, S.

Journal:

IEEE Transactions on Instrumentation and Measurement

Year:

2003

Language:

english

File:

PDF, 1.01 MB

english, 2003

45

[IEEE IMTC 2001. Proceedings of the 18th IEEE Instrumentation and Measurement Technology Conference. Rediscovering Measurement in the Age of Informatics - Budapest, Hungary (21-23 May 2001)] IMTC 2001. Proceedings of the 18th IEEE Instrumentation and Measurement Technology Conference. Rediscovering Measurement in the Age of Informatics (Cat. No.01CH 37188) - An improved method for automatic detection and location of defects in electronic components using scanning ultrasonic microscopy

Bechou, L., Dallet, D., Danto, Y., Daponte, P., Ousten, Y., Rapuano, S.

Year:

2001

Language:

english

File:

PDF, 597 KB

english, 2001

46

[IEEE 2005 IEEE Instrumentationand Measurement Technology - Ottawa, ON, Canada (16-19 May 2005)] 2005 IEEE Instrumentationand Measurement Technology Conference Proceedings - Intra-IC Inspection and Metrology with Picosecond Laser Ultrasonics

Andriamonje, G., Pouget, V., Ousten, Y., Lewis, D., Fouillat, P., Danto, Y.

Year:

2005

Language:

english

File:

PDF, 237 KB

english, 2005

47

[IEEE 2014 IEEE Aerospace Conference - Big Sky, MT, USA (2014.3.1-2014.3.8)] 2014 IEEE Aerospace Conference - Long term in-vacuum reliability testing of 980nm laser diode pump modules for space applications

Pedroza, Guillaume, Bechou, Laurent, Ousten, Yves, How, Lip Sun, Gilard, Olivier, Goudard, Jean-Luc, Laruelle, Francois

Year:

2014

Language:

english

File:

PDF, 2.74 MB

english, 2014

48

[IEEE Management Symposium (SEMI-THERM) - San Jose, CA, USA (2011.03.20-2011.03.24)] 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium - Study of thermal interfaces aging for power electronics applications

Ousten, J.-P., Khatir, Z., Menager, L.

Year:

2011

Language:

english

File:

PDF, 2.09 MB

english, 2011

49

[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - A simplified and meaningful crack propagation model in silicon for microelectronic power devices

Calvez, D., Roqueta, F., Jacques, S., Ducret, S., Bechou, L., Ousten, Y.

Year:

2012

Language:

english

File:

PDF, 1.82 MB

english, 2012

50

[IEEE 2008 IEEE Radiation Effects Data Workshop - Tucson, AZ (2008.07.14-2008.07.18)] 2008 IEEE Radiation Effects Data Workshop - Evaluation of Static and Dynamic Performance of Silicon-Based Bipolar Phototransistors Under Radiation

Quadri, G., Gilard, O., Roux, J. L., Spezzigu, P., Bechou, L., Vanzi, M., Ousten, Y., Gibard, D.

Year:

2008

Language:

english

File:

PDF, 564 KB

english, 2008